CyberCoders Wirebond Product Manager - Wirebond, Product Manager, OSAT in Fremont, California
Wirebond Product Manager - Wirebond, Product Manager, OSAT Wirebond Product Manager - Wirebond, Product Manager, OSAT - Skills Required - Wirebond, Product Manager, OSAT
If you are a Wirebond Product Manager with flip chip, wafer level packaging experience, please read on!
Located in Fremont, CA. We are a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. We have the scale to provide a comprehensive range of semiconductor packaging and test solutions to a diversified global customer base servicing the computing, communications and consumer markets.
Own Wirebond Product Line. Drive related technology road mapping and business development activities in securing new customer engagements & design wins. Collaborate with R&D teams to promote new products that are in development as well as provide direction for future development.
What You Will Be Doing
- Co-own with R&D JCET Group 5 year wirebond roadmap; understand OSAT customer (IC vendors)
roadmaps and use this to frame our technology roadmap
Own marketing collateral related to Wirebond capabilities
Identify target customers related to Wirebond for engagement and business development
Own inputing Market Requirement Specifications (MRS) to R&D to launch new R&D projects as related
Own JCET Group Wirebond value proposition and ensure it is well represented in marketing collateral
Co-own with MARCOM JCET Group website content related to Wirebond capability
Own Sales/PDE training of JCET Group wirebond capability (2x/yr)
Understand overall Wirebond industry landscape including OSAT TAM/SAM and OSAT competitive
Support Sales/PDE in new customer development, particularly from the technology angle
Own all of our Automotive related marketing collateral across all product offering areas.
Train the technical part of the Sales team (PDE) in our Automotive offerings 2x/year.
Ensure that our Product Offering roadmaps meet the emerging needs of the Automotive segment.
What You Need for this Position
- 10+ year industry experience in wirebond packaging; Direct semiconductor packaging experience is
Experience in Automotive packaging required (need to understand the various Automotive certifications)
Analog and Memory market segment background and credentials desired.
Experience with advanced packaging (flip chip, wafer level packaging) desired.
Minimum of a Masters Degree in an engineering field related to semiconductor packaging. MBA is good
but not required. Prior experience in business development preferred.
- Solid interpersonal and communication skills as will be communicating with individuals at all levels
inside and outside the organization.
Result oriented, self-motivated and driven personality. Be able to drive successful results.
Experience working in a highly dynamic business environment.
Mandarin speaking desired due to interactions with JCET Group China.
What's In It for You
Bonuses, full medical and dental coverage, retirement plans, paid vacation and time off and MUCH MORE!
So, if you are a Wirebond Product Manager with flip chip, wafer level packaging experience, please apply today!
Applicants must be authorized to work in the U.S.
CyberCoders, Inc is proud to be an Equal Opportunity Employer
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability, protected veteran status, or any other characteristic protected by law.
Your Right to Work – In compliance with federal law, all persons hired will be required to verify identity and eligibility to work in the United States and to complete the required employment eligibility verification document form upon hire.
Wirebond Product Manager - Wirebond, Product Manager, OSAT CA-Fremont DG4-1455020